Allied Market Research, titled, “Flip Chip Market by Packaging Technology, Bumping Technology, and Industry: Opportunity Analysis and Industry Forecast, 2020–2027,” the flip chip market size was valued at $24.76 billion in 2019, and is projected to reach $39.67 billion by 2027, growing at a CAGR of 6.1% from 2020 to 2027.  Increase in demand for high speed and...

Executive Summary Wafer Level Packaging Market : Wafer level packaging market will expect to grow at a rate of 21.0% for the forecast period of 2021 to 2028. Wafer level packaging market report analyses the growth, which is currently being growing due to the impending need for circuit miniaturization in microelectronic devices. The transparent, trustworthy and extensive market...