Epoxy Resin Molding Compounds for Semiconductor Packaging to Surpass USD 3.4 Billion by 2032 Global Epoxy Resin Molding Compounds For Semiconductor Encapsulation market size was valued at USD 1.8 billion in 2024. The market is projected to grow from USD 1.96 billion in 2025 to USD 3.4 billion by 2032, exhibiting a CAGR of 7.1% during the forecast period. Get Full Report Here: https://www.24chemicalresearch.com/reports/216758/epoxy-resin-molding-compounds-for-semiconductor-encapsulation-market-2023-2032-907