Allied Market Research, titled, “Flip Chip Market by Packaging Technology, Bumping Technology, and Industry: Opportunity Analysis and Industry Forecast, 2020–2027,” the flip chip market size was valued at $24.76 billion in 2019, and is projected to reach $39.67 billion by 2027, growing at a CAGR of 6.1% from 2020 to 2027.  Increase in demand for high speed and...

Allied Market Research published an exclusive report, titled, “𝐒𝐞𝐦𝐢𝐜𝐨𝐧𝐝𝐮𝐜𝐭𝐨𝐫 𝐁𝐨𝐧𝐝𝐢𝐧𝐠 𝐌𝐚𝐫𝐤𝐞𝐭 by Type (Die Bonder, Wafer Bonder, Flip Chip Bonder), by Process Type (Die To Die Bonding, Die To Wafer Bonding, Wafer To Wafer Bonding), by Bonding Technology (Die Bonding Technology, Wafer Bonding Technology), by Application (RF Devices, Mems and Sensors, CMOS Image Sensors, LED, 3D NAND):...

The global Underfill Market is experiencing significant growth, driven by the increasing demand for advanced electronics and the proliferation of miniaturized devices. According to a recent report by Dataintelo, the market is projected to reach a valuation of USD 1.2 billion by 2030, growing at a CAGR of 8.5% from 2023 to 2030. This growth is fueled by the rising...

Executive Summary Wafer Level Packaging Market : Wafer level packaging market will expect to grow at a rate of 21.0% for the forecast period of 2021 to 2028. Wafer level packaging market report analyses the growth, which is currently being growing due to the impending need for circuit miniaturization in microelectronic devices. The transparent, trustworthy and extensive market...